高密度隔热 18毫米T&G绿色wedi板
粘结所有关节并浮动楼层
响应你最后一篇文章时,是的,只要把板放在隔热上,如上所述,粘合所有关节,在边缘留下扩展空白

双选方案 1 减厚隔热并保持75毫米高压2使用浮动楼层系统,即75毫米固定15毫米平滑顶部

hi you have made a massive mistake or your builders have their is no way you can go with building regulations so if the floor cant be taken down to lower level then you have only limited options either disregard any floor insulation and go for a 90 mm screed or use a thinner insulation and make up the deiff with new floor screed .or use a false floor and use 3x2 timbers and 22mm or 18mm chipboard and insulate beteeen the timbers making sure you lay a membrene down first other than that ask the building control how best to resolve problem

75毫米Kingspan绝缘和18毫米T&G绿色芯片板顶部或70毫米隔热和22毫米T&G绿色芯片板顶部和当然所有关节粘合

30毫米隔热60毫米